Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• providing an integrated circuit die having an active side facing down and a passive facing up;
• providing a contact pad having a top side facing up;
• connecting an inner bond wire to the contact pad and the active side of the integrated circuit die with the inner bond wire extending downward from the active side and bending upward;
• molding a stacking structure around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity;
• fabricating a substrate having a top surface for mounting the stacking structure and the integrated circuit die;
• attaching a bottom chip on the top surface;
• mounting the stacking structure on the top surface and over the bottom chip, with a portion of the bottom chip within the cavity;
• attaching the top chip to the passive side of the integrated circuit die;
• and
• forming an encapsulation on the top surface of the substrate to enclose the top chip, the stacking structure, and the bottom chip.

An integrated circuit packaging system comprising:

• an integrated circuit die having an active side and a passive side;
• an inner bond wire connected to the integrated circuit die;
• a contact pad connected to the inner bond wire with the contact pad having a top side oriented in the same direction as the passive side;
• and
• a stacking structure molded around the contact pad, the inner bond wire, and the integrated circuit die with the passive side and the top side exposed, and the stacking structure having a top structure surface on top and adjacent to or below the integrated circuit die, and a horizontal member under the integrated circuit die and forming a cavity.