Semiconductor device and method of manufacturing the same
OwnerJi-Hwang KIM, Sunpil Youn +3inventors
InventorsJi-Hwang KIM, Sunpil Youn, Sangwon Kim, Kwang-chul Choi, Tae Hong Min
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Abstract
A semiconductor device includes a substrate having a first side and a second side such that the first and second sides face each other, a through via plug penetrating the substrate, an insulating film liner, and an antipollution film. The insulating film liner is between the through via plug and the substrate and the insulating film liner has a recessed surface with respect to the second side. The antipollution film covers the second side and the antipollution film is on the recessed surface and between the through via plug and the substrate.
Claims15
A semiconductor device, comprising:
- a substrate including a first side and a second side, the first and second sides facing each other;
- a through via plug penetrating the substrate;
- an insulating film liner between the through via plug and the substrate, the insulating film liner having a recessed surface with respect to the second side;
- and
- an antipollution film covering the second side, the antipollution film being between the through via plug and a portion of the substrate on the recessed surface.
7-12. (canceled)
A semiconductor device, comprising:
- a substrate including a first side and a second side, the first and second sides facing each other;
- a through via plug penetrating the substrate, the through via plug including a protruding portion that extends beyond the second side of the substrate;
- a diffusion prevention film between the through via plug and the substrate, the diffusion prevention film being on the protruding portion of the through via plug;
- an insulating film liner between the diffusion prevention film and the substrate;
- and
- an antipollution film covering the second side, the antipollution film being on the insulating film liner and being on the protruding portion of the through via plug.
Dependencies are inferred from the claim text.