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US 2012/0235303 A1Published application
Reinforcement structure for flip-chip packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Wen Liu, Ching-Jung Yang, Hsien-Wei Chen, Hsin-Yu Pan, Chao-Wen Shih
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Abstract
The present disclosure provides a carrier substrate, a device including the carrier substrate, and a method of bonding the carrier substrate to a chip. An exemplary device includes a carrier substrate having a chip region and a periphery region, and a chip bonded to the chip region of the carrier substrate. The carrier substrate includes a reinforcement structure embedded within the periphery region.
Claims20
A device comprising:
- a carrier substrate having a chip region and a periphery region, wherein the carrier substrate includes a reinforcement structure embedded within the periphery region;
- and
- a chip bonded to the chip region of the carrier substrate.
A package substrate comprising:
- a laminate substrate including a chip region and a periphery region, the chip region being configured for bonding to a chip;
- and
- a reinforcement structure embedded within the periphery region of the laminate substrate.
A method comprising:
- providing a carrier substrate that includes a chip region and a periphery region, wherein the carrier substrate includes a reinforcement structure embedded within the periphery region;
- and
- bonding a chip to the chip region of the carrier substrate.
Dependencies are inferred from the claim text.