Ic devices having tsvs including protruding tips having imc blocking tip ends

An integrated circuit (IC) device, comprising:

• a first IC chip and a second IC chip joined with a metallurgical join;
• the first IC chip includes:
• a plurality of TSVs extending from a topside semiconductor surface to a TSV tip protruding from a bottomside surface of the die, wherein the protruding TSV tip has a circumferential sidewall and a bottom surface;
• an end portion of the circumferential sidewall of the TSV tip embedded in a cap of a first metal exclusive solder, which also covers the bottom surface of the protruding TSV tip;
• and
• a layer of a second metal exclusive solder and different from said first metal having a bulbous shape covering said cap of the first metal layer and a portion of the circumferential sidewall not embedded in the cap of the first metal;
• the second IC chip having a plurality of protruding bonding features aligned to the TSV tips with bulbous shaped second metal layer;
• and
• the metallurgical joint between each TSV tip and each protruding bonding feature, including a solder portion adjacent the second metal layer.