Semiconductor device including a base plate
AssigneeInfineon Technologies AG
InventorsPatrick Jones, Andre Christmann
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip and a base plate coupled to the semiconductor chip. The base plate includes an upper portion and a lower portion. The upper portion has a bottom surface intersecting a sidewall of the lower portion. The semiconductor device includes a cooling element coupled to the base plate. The cooling element has a first surface directly contacting the bottom surface of the upper portion of the base plate, a second surface directly contacting the sidewall of the lower portion of the base plate, and a third surface parallel to the first surface and aligned with a bottom surface of the lower portion of the base plate.
Claims20
A semiconductor device comprising:
- a semiconductor chip;
- a base plate coupled to the semiconductor chip, the base plate comprising an upper portion and a lower portion, the upper portion having a bottom surface intersecting a sidewall of the lower portion;
- and
- a cooling element coupled to the base plate, the cooling element having a first surface directly contacting the bottom surface of the upper portion of the base plate, a second surface directly contacting the sidewall of the lower portion of the base plate, and a third surface parallel to the first surface and aligned with a bottom surface of the lower portion of the base plate.
A module comprising:
- a power semiconductor chip;
- a base plate coupled to the power semiconductor chip;
- and
- a cooling element coupled to the base plate, the cooling element comprising an inlet and an outlet for passing a coolant through the cooling element, the inlet and outlet defined by a first surface of the cooling element;
- wherein a first surface of the base plate is aligned with the first surface of the cooling element.
A method for fabricating a semiconductor device, the method comprising:
- providing a cooling element comprising an inlet, an outlet, a cavity between the inlet and the outlet, and an opening through the cooling element to the cavity, the opening having a sidewall;
- coupling a semiconductor chip to a base plate;
- and
- coupling the base plate to the cooling element such that a first portion of the base plate extends into the opening and a second portion of the base plate extends over the sidewall of the opening.
Dependencies are inferred from the claim text.