Semiconductor apparatus and method for manufacturing the same

A method for manufacturing a semiconductor apparatus including a semiconductor device and a heat spreader, the method comprising:

• providing a containing unit and a holding unit outside a region of a bonding of the semiconductor device to the heat spreader, the containing unit being configured to contain melted solder in an interior of the containing unit, the holding unit being configured to allow melted solder held in an interior of the holding unit to flow between the holding unit and the containing unit;
• providing a regulating unit between the semiconductor device and the heat spreader, the regulating unit being configured to regulate a dimension between the semiconductor device and the heat spreader;
• supplying a prescribed amount of solder to the interior of the containing unit and the interior of the holding unit;
• pressurizing the semiconductor device and the heat spreader in a direction toward each other with the regulating unit interposed;
• melting the solder by heating in the pressurized state;
• and
• cooling the melted solder,
• the melted solder being replenished from the holding unit in the case where an amount of the melted solder contained in the containing unit is insufficient and being recovered into the holding unit in the case where the amount of the melted solder is excessive in the cooling of the melted solder.