Power module for an automobile
AssigneeValeo Etudes Electroniques
InventorsJean-Michel Morelle, Ky Lim Tan, Laurent Vivet, Sandra Dimelli, Stéphane Thomelin, Hervé Lorin, Patrick Dubus
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Abstract
The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterised in that said module includes two vertically adjacent semiconducting chips (12, 14), each chip having a first surface (20, 22) to be connected to a heat sink substrate (24, 26), and a second surface (28, 30) separate from the first and on which at least one electronic component (38a-44b) is arranged, the module being arranged such that the second surfaces of the chips are arranged opposite one another.
Claims10
A power module for an electric vehicle the power module comprising:
- two superposed semiconductor wafers, each wafer comprising a first face, configured to be connected to a heat dissipating substrate, and a second face, distinct from the first, on which at least one electronic component is arranged,
- wherein the second faces of the two superposed semiconductor wafers are disposed facing each other.
An assembly method for a power module comprising two semiconductor wafers, the assembly method comprising:
- placing at least one electric component onto a connection face of each of the two semiconductor wafers, wherein the connection face of each wafer is one of two faces of each wafer;
- and
- superposing the two semiconductor wafers so that the connection faces of each wafer are placed opposing each other.
Dependencies are inferred from the claim text.