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US 2012/0235288 A1Published application
Semiconductor device and method of manufacturing same
AssigneeSumitomo Electric Industries, Ltd.
InventorJiro SHINKAI
Life of this patent
Estimating the term…
Abstract
A semiconductor device in accordance with an embodiment comprises a semiconductor chip; a die pad having a chip mount surface for mounting the semiconductor chip; first leads electrically connected to the semiconductor chip; a thermosetting resin part for securing end parts of the first leads to the die pad; and a thermoplastic resin part for sealing the semiconductor chip, the die pad, and the thermosetting resin part.
Claims8
A semiconductor device comprising:
- a semiconductor chip;
- a die pad having a chip mount surface for mounting the semiconductor chip;
- a first lead having an end part electrically connected to the semiconductor chip;
- a thermosetting resin part for securing the end part of the first lead to the die pad;
- and
- a thermoplastic resin part for sealing the semiconductor chip, the die pad, and the thermosetting resin part.
3 more elements
A method of manufacturing a semiconductor device, the method comprising the steps of:
- mounting a semiconductor chip to a chip mount surface of a die pad;
- electrically connecting the semiconductor chip and an end part of a first lead to each other;
- securing the end part of the first lead to the die pad with a thermosetting resin;
- and
- sealing the thermosetting resin, the semiconductor chip, and the die pad with a thermoplastic resin.
2 more elements
Dependencies are inferred from the claim text.