Inserts for directing molding compound flow and semiconductor die assemblies
AssigneeMicron Technology, Inc.
InventorStephen L. James
Life of this patent
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Abstract
Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as a paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice.
Claims20
An insert for a semiconductor device packaging mold, the insert comprising:
- baffles configured to reduce a flow rate of resin between laterally separated semiconductor dice attached to a substrate within a semiconductor device packaging mold;
- and
- structural supports interconnecting ends of a plurality of the baffles to each other.
A semiconductor die assembly, comprising:
- at least one semiconductor die, comprising:
- an upper major surface;
- a lower major surface opposite the upper major surface;
- and
- at least one lateral side extending between the upper major surface and the lower major surface;
- and
- a lead frame associated with the at least one semiconductor die, comprising:
- at least one member proximate the at least one semiconductor die having at least a portion thereof configured in a substantially non-parallel orientation relative to the upper major surface of the at least one semiconductor die, the at least a portion of the at least one member for impeding flow of molten dielectric packaging material around the at least one lateral side of the at least one semiconductor die in a molding process.
Dependencies are inferred from the claim text.