# US 2012/0235263 A1 · Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

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- Number: US 2012/0235263 A1
- Document ID: US20120235263A1
- Status: Published application
- Kind: A1
- Application number: 13/362,722
- Filed: 2012-01-31
- Published: 2012-09-20
- Earliest claimed: 2011-03-14
- Assignees: Sony Corporation
- Inventors: Tomoharu OGITA; Atsushi YAMAMOTO; Keiji TATANI; Yoichi OOTSUKA
- Web page: https://patentgrep.com/patent/US20120235263A1

## CPC

- H10F 39/8053: {Colour filters}
- H10F 39/024: {of coatings or optical elements}
- H10F 39/8057: {Optical shielding}
- H10F 39/8063: {Microlenses}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters associated with the pixels and having a plurality of color filter components, microlenses converging the incident light through the color filters to the photoelectric conversion elements, a light shielding film disposed between the color filter components of the color filters, and a nonplanarized adhesive film provided between the color filters and the light shielding film.

## Claims

### Claim 1

A solid-state imaging device comprising:
pixels each having a photoelectric conversion element for converting incident light to an electric signal;
color filters associated with the pixels and having a plurality of color filter components;
microlenses converging the incident light through the color filters to the photoelectric conversion elements;
a light shielding film disposed between the color filter components of the color filters; and
a nonplanarized adhesive film provided between the color filters and the light shielding film.

### Claim 2 (depends on 1)

The solid-state imaging device according to claim 1, wherein the color filters are planarized.

### Claim 3 (depends on 1)

The solid-state imaging device according to claim 1, wherein the adhesive film is provided between one surface of the light shielding film and the color filters.

### Claim 4 (depends on 1)

The solid-state imaging device according to claim 1, further comprising:
an insulator film between the photoelectric conversion elements and the color filters;
wherein the color filters are embedded in the insulator film.

### Claim 5 (depends on 1)

The solid-state imaging device according to claim 1, wherein an oxide film is provided between the adhesive film and the light shielding film.

### Claim 6 (depends on 5)

The solid-state imaging device according to claim 5, wherein the oxide film is provided on one surface of the light shielding film.

### Claim 7 (depends on 1)

The solid-state imaging device according to claim 1,
wherein the light shielding film includes
first light shielding portions formed on side portions of the color filter components, and
second light shielding portions formed at corner portions of the pixel regions,
wherein a distance from the front side of the pixel to an end surface of the second light shielding portion toward the microlens is shorter than a distance from the front side of the pixel to an end surface of the first light shielding portion toward the microlens.

### Claim 8

A method of manufacturing a solid-state imaging device, the method comprising:
forming pixels each having a photoelectric conversion element for converting incident light to an electric signal;
forming a light shielding film to be provided between a plurality of color filter components of color filters;
depositing a nonplanarized adhesive film on the light shielding film;
forming the color filters on the adhesive film between the light shielding films; and
forming on the color filters microlenses converging the incident light through the color filters onto the photoelectric conversion elements.

### Claim 9

An electronic apparatus comprising:
a solid-state imaging device including
pixels each having a photoelectric conversion element for converting incident light to an electric signal,
color filters associated with the pixels and having a plurality of color filter components,
microlenses converging the incident light through the color filters to the photoelectric conversion elements,
a light shielding film disposed between the color filter components of the color filters, and
a nonplanarized adhesive film provided between the color filters and the light shielding film; and
an optical lens guiding the incident light to the photoelectric conversion elements; and
a signal processing circuit processing the electric signal.