Semiconductor package and method of fabricating the same

A method of fabricating a semiconductor package, comprising the steps of:

• preparing a pre-formed package, the pre-formed package comprising:
• a substrate having a first surface and a second surface opposing the first surface;
• a plurality of semiconductor components mounted and electrically connected to the first surface of the substrate;
• and
• an encapsulant covering the first surface of the substrate and the semiconductor components;
• forming a trench in the encapsulant of the pre-formed package for dividing into a plurality of package units on the substrate to allow each of the package units to have at least one of the semiconductor components;
• and
• forming a metal layer on the encapsulant and the substrate, wherein the metal layer is further formed in the trench to cover each of the package units.