Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsKazuhide ABE, Tadahiro Sasaki, Kazuhiko Itaya
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AssigneeKabushiki Kaisha Toshiba
InventorsKazuhide ABE, Tadahiro Sasaki, Kazuhiko Itaya
Estimating the term…
One embodiment of a semiconductor device provided with a semiconductor substrate, a device region formed on the semiconductor substrate, a device isolation region, which encloses the device region, a plurality of first gate electrodes arranged so as to be parallel to each other on the device region and electrically connected to each other, and a plurality of second gate electrodes arranged so as to be parallel to a plurality of first gate electrodes on the device region and electrically connected to each other, wherein the first gate electrode is arranged so as to be interposed between the second gate electrodes, a gate width of the first gate electrode is smaller than the gate width of the second gate electrode, and a DC bias voltage higher than that of the second gate electrode is applied to the first gate electrode.
A semiconductor device, comprising:
Dependencies are inferred from the claim text.