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US 2012/0235202 A1Published application
Light Emitting Device and Method of Manufacturing a Light Emitting Device
AssigneeOSRAM Opto Semiconductors GmbH
InventorKimberly Peiler
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Abstract
A light emitting device comprising a heat sink, a dielectric layer arranged on the heat sink, a heat conductive layer arranged on the dielectric layer, an undercoating arranged on at least a part of the heat conductive layer, and a light emitting chip attached to the heat conductive layer by means of the undercoating.
Claims12
A light emitting device comprising:
- a heat sink;
- a dielectric layer arranged on the heat sink;
- a heat conductive layer arranged on the dielectric layer;
- an undercoating arranged on at least a part of the heat conductive layer;
- a light emitting chip attached to the heat conductive layer by the undercoating;
- and
- an optical element arranged in the beam path of the light emitting chip, and wherein a circuit is arranged on the side of the heat sink which is facing away from the light emitting chip.
4 more elements
Dependencies are inferred from the claim text.