Light emitting diode package structure
AssigneeLextar Electronics Corporation
InventorsPei-Song Cai, Tzu-Pu Lin, Szu-Wei Fu
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Abstract
The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
Claims14
A light emitting diode package structure, comprising:
- a substrate;
- a light emitting diode chip formed on the substrate;
- a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm;
- a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip;
- and
- an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
Dependencies are inferred from the claim text.