US 2012/0235194 A1Published application

Light emitting diode package

AssigneeAdvanced Optoelectronic Technology, Inc.

InventorsHSIN-CHIANG LIN, PIN-CHUAN CHEN

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Abstract

An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame.

Claims13

Dependent claims

An LED package comprising:

an insulated frame having a receiving groove defined therein;
a first metallic conductor configured for electrically connecting with an external device, comprising a first mounting portion exposed to the receiving groove and a first reflecting portion extending from the first mounting portion into the insulated frame;
a second metallic conductor configured for electrically connecting with the external device, comprising a second mounting portion exposed to the receiving groove and a second reflecting portion extending from the second mounting portion into the insulated frame, the second mounting portion being spaced from the first mounting portion, the first reflecting portion and the second reflecting portion cooperatively surrounding the receiving groove of the insulated frame;
a radiation emitting semiconductor chip located in the receiving groove of the insulated frame and electrically connected to the first mounting portion of the first metallic conductor and the second mounting portion of the second metallic conductor;
and
an encapsulation filled in the receiving groove of the insulated frame and encapsulating the radiation emitting semiconductor chip.

3 more elements

Dependencies are inferred from the claim text.