Packaged Semiconductor Light Emitting Devices Having Multiple Optical Elements and Methods of Forming the Same
AssigneeCree, Inc.
InventorNicholas W. Medendorp, JR.
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Abstract
Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.
Claims13
A method of packaging a semiconductor light emitting device, comprising:
- providing a substrate having the semiconductor light emitting device on a front face thereof;
- forming a first optical element from a first material on the front face proximate the semiconductor light emitting device using a process other than compression molding;
- forming a second optical element from a second material, different from the first material, over the semiconductor light emitting device and the first optical element by compression molding the second optical element without leaving a gap between the first optical element and the second optical element, wherein the second optical element is formed to have a bi-axially symmetric shape centered over the semiconductor light emitting device and wherein the first optical element and the second optical element have different refractive indexes selected to provide a desired optical characteristic for the packaged semiconductor light emitting device;
- and
- leaving an upper surface of the second optical element in contact with air in the packaged semiconductor light emitting device.
A method of packaging a semiconductor light emitting device, comprising:
- providing a substrate having a plurality of semiconductor light emitting devices on a front face thereof;
- forming a plurality of first optical elements of a first material on the front face proximate respective ones of the plurality of semiconductor light emitting devices;
- forming a plurality of second optical elements of a second material on the plurality of first optical elements using compression molding, wherein the plurality of second optical element are located over corresponding ones of the plurality of semiconductor light emitting devices and wherein respective ones of the plurality of second optical elements have different shapes selected to provide a desired optical performance characteristic.
A packaged semiconductor light emitting device, comprising:
- a substrate having a plurality of semiconductor light emitting devices on a front face thereof;
- a plurality of first optical elements of a first material on the front face proximate respective ones of the plurality of semiconductor light emitting device;
- a plurality of compression molded second optical elements of a second material on the plurality of first optical elements, wherein the plurality of second optical elements are located over corresponding ones of the plurality of semiconductor light emitting devices and wherein respective ones of the plurality of second optical elements have different shapes selected to provide a desired optical performance characteristic.
A packaged semiconductor light emitting device, comprising:
- a substrate having a semiconductor light emitting device on a front face thereof;
- a first optical element of a first material on the front face proximate the semiconductor light emitting device;
- and
- a second optical element of .a second material, different from the first material, on the first optical element, wherein the second optical element is on the first optical element with no gap therebetween and wherein an upper surface of the second optical . element is in contact with air in the packaged semiconductor light emitting device and wherein the first optical element and the second optical element have different refractive indexes selected to provide a desired optical characteristic for the packaged semiconductor light emitting device and wherein the second optical element is formed to have a bi-axially symmetric shape centered over the semiconductor light emitting device.
Dependencies are inferred from the claim text.