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US 2012/0235141 A1Published application
Semiconductor memory system
AssigneeKabushiki Kaisha Toshiba
InventorsHayato MASUBUCHI, Naoki Kimura, Manabu Matsumoto, Toyota Morimoto
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Abstract
According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.
Claims20
A semiconductor memory system comprising:
- a substrate having a multilayer structure in which wiring patterns are formed, and having a substantially rectangle shape in plan view;
- a plurality of elements provided and arranged along a long-side direction of a surface layer side of the substrate;
- and
- an adhesive portion filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.
1 more element
Dependencies are inferred from the claim text.