Laser scribing with extended depth affectation into a workplace
AssigneeJ.P. Sercel Associates Inc.
InventorsJeffrey P. Sercel, Marco Mendes, Mathew Hannon, Michael von Dadelszen
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AssigneeJ.P. Sercel Associates Inc.
InventorsJeffrey P. Sercel, Marco Mendes, Mathew Hannon, Michael von Dadelszen
Estimating the term…
Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.
A method of laser scribing a workpiece, the method comprising:
A method of laser scribing a workpiece, the method comprising:
A laser machining system comprising:
Dependencies are inferred from the claim text.