Method and Device for Treating a Substrate Surface of a Substrate
AssigneeGebr. Schmid GmbH & Co.
InventorChristian Schmid
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Abstract
In a method for the treatment of a substrate surface of a flat substrate with a process medium at the substrate underside, the process medium has a removing or etching effect on the substrate surface. The substrates are wetted with the process medium from below in a manner lying horizontally. The upwardly facing substrate top side is wetted or covered with water or a corresponding protective liquid over a large area or over the whole area as protection against the process medium acting on the substrate top side.
Claims23
A method for treating a substrate surface of a flat substrate with a process medium at the substrate underside, wherein the process medium has a removing or etching effect on the substrate surface, the method comprising the steps of:
- wetting the substrates with the process medium from below with the substrates lying horizontally;
- and
- wetting or covering the upwardly facing substrate top side with water or a corresponding protective liquid over a large area or over the whole area as protection against the process medium or the outgassings thereof acting on or reaching the substrate top side.
Dependencies are inferred from the claim text.