Electrochemical plating
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Kuang Lien, Lun-Chieh Chiu, Yu-Min Chang
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Abstract
A method for electrochemical plating includes providing a wafer for an electrochemical plating (ECP) process, determining a wafer electrical property affecting the ECP process, adjusting a plating current or voltage applied in the ECP process based on the determined wafer electrical property, and electroplating the wafer with the adjusted plating current or voltage. A controller for controlling a power supply, and a system for electrochemical plating are also disclosed.
Claims20
A method of electrochemical plating, comprising:
- providing a wafer for an electrochemical plating (ECP) process;
- determining a wafer electrical property affecting the ECP process;
- adjusting a plating current or voltage applied in the ECP process based on the determined wafer electrical property;
- and
- electroplating the wafer with the adjusted plating current or voltage.
A controller for controlling a plating current or voltage in an electrochemical plating (ECP) process of a wafer, the controller comprising:
- a memory;
- and
- a processor configured to:
- obtain a wafer electrical property affecting the ECP process;
- adjust the plating current or voltage applied in the ECP process based on the determined wafer electrical property;
- and
- apply the adjusted plating current or voltage to a wafer undergoing the ECP process.
A system for electrochemical plating, comprising:
- a plating bath;
- a substrate mount for holding a wafer for an electrochemical plating (ECP) process within the plating bath;
- an anode;
- a power supply operably coupled to the anode and the substrate mount;
- and
- a controller operably coupled to the power supply, the controller including:
- a memory;
- and
- a processor configured to:
- obtain a wafer electrical property affecting the ECP process;
- and
- control the power supply to adjust the plating current or voltage applied in the ECP process based on the obtained wafer electrical property;
- and
- apply the adjusted plating current or voltage to a wafer undergoing the ECP process.
Dependencies are inferred from the claim text.