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US 2012/0234682 A1Published application
Process For Copper Plating Of Polyamide Articles
AssigneeE.I. du Pont de Nemours and Company
InventorsCharles J. Dubois, Andri E. Elia, Juan Carlos Figueroa
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Abstract
This invention relates to a process for metal-coating a polyamide surface, to achieve metal-polyamide adhesion, and such metal-coated polyamide articles.
Claims5
A process for applying a copper-coating to a polyamide article, the process comprising the steps of:
- i) chemically treating a surface of a polyamide article to provide an electrically conductive polyamide article;
- ii) immersing the electrically conductive polyamide article into an electroplating solution comprising:
- (a) 188-250 ml/L copper sulfate
- (b) 47-78 ml/L sulfuric acid
- (c) 20-200 mg/L chloride ion
- (d) greater than 1.0-2.4% of Aldolyte AC-12E
- (e) greater than 1.25 ml/L of Aldolyte AC-14L
- (f) greater than 3-6% Aldolyte AC-W-22
- iii) applying a cathode current density of 360-601 amp/sq. meter to an electroplating solution cathode using phosphorized copper anodes to obtain a copper coated polyamide article;
- wherein the copper coated polyamide article has a peel strength between the copper and polyamide article surface of greater than 12 N cm−1;
- and
- wherein electroplating solution concentrations are based on the total volume of the electroplating solution.
9 more elements
Dependencies are inferred from the claim text.