Loading patent…
AssigneeApplied Materials, Inc.
InventorsWilliam BOTTENBERG, John Telle, David H. Meakin, Brian J. Murphy
Estimating the term…
Embodiments of the invention generally relate to conductive foils having multiple layers for use in photovoltaic modules and methods of forming the same. The conductive foils generally include a layer of aluminum foil having one or more metal layers with decreased contact resistance disposed thereon. An anti-corrosion material and a dielectric material are generally disposed on the upper surface of the metal layer. The conductive foils may be formed on a carrier prior to construction of a photovoltaic module, and then applied to the photovoltaic module as a conductive foil assembly during construction of the photovoltaic module. Methods of forming the conductive foils generally include adhering an aluminum foil to a carrier, removing native oxides from a surface of the aluminum foil, and sputtering a metal onto the aluminum foil. A dielectric material and an anti-corrosion material may then be applied to the upper surface of the sputtered metal.
A substrate for interconnecting photovoltaic devices, comprising:
A substrate for interconnecting photovoltaic devices, comprising:
A substrate for interconnecting photovoltaic devices, comprising:
A method of forming a conductive foil assembly, comprising:
Dependencies are inferred from the claim text.