US 2012/0234589 A1 · WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Abstract

A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.

Claims9

Dependent claims

A wiring substrate, comprising:

a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side;
an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted;
and
a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side,
wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions each other.

2 more elements

A method of manufacturing a wiring substrate, comprising:

mounting an interposer on a support base material;
forming an insulating layer covering the interposer, on the support base material;
forming a via hole in the insulating layer and forming a wiring layer on the insulating layer, the wiring layer which is electrically connected to the interposer through the via hole;
stacking a insulating layer and a wiring layer alternately;
stacking a sheet-shaped member having an opening portion, on the stacked insulating layer;
forming an insulating layer covering the sheet-shaped member having the opening portion, thereby burying the sheet-shaped member by the insulating layer;
forming a via hole in the insulating layer burying the sheet-shaped member and the insulating layer located under thereof, according to a position of the opening portion of the sheet-shaped member, and forming an outermost wiring layer electrically connected to the underlying wiring layer through the via hole, on the burying insulating layer;
and
removing the support base material.

6 more elements

Dependencies are inferred from the claim text.

Wiring substrate and method of manufacturing the same

Life of this patent

Wiring substrate and method of manufacturing the same

Life of this patent

Abstract

Claims9