Printed wiring board, printed circuit board unit, electronic apparatus and method for manufacturing printed wiring board

A printed wiring board comprising:

• insulating layers including a prepreg layer;
• conductive layers stacked with the insulating layers alternately;
• a through hole penetrating the insulating layers and the conductive layers;
• a plate resist part formed on a first portion of an inner wall of the through hole, the first portion being formed in the prepreg layer and located between a pair of the conductive layers;
• and
• a plated part formed on a second portion of the inner wall of the through hole other than the first portion of the inner wall of the through hole.

A method for manufacturing a printed wiring board, the method comprising:

• stacking conductive layers and insulating layers alternately;
• forming a through hole penetrating the conductive layers and insulating layers;
• forming a plate resist part on a first portion of an inner wall of the through hole, the first portion being located from one end of the through hole to one of the conductive layers stacked between one pair of the insulating layers;
• and
• forming a plated part on a second portion of the inner wall of the through hole other than the first portion.