Support for Electronic Circuits
AssigneeSchoeller Technocell GmbH & Co. KG
InventorsWolfgang Schmidt, Kirsten Barth-Gremmel
Life of this patent
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Abstract
Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm as an outer layer.
Claims20
A support material for printing electronic circuits by means of the inkjet printing process with electrically conductive inks, comprising a base material and an outer microporous layer arranged on at least one side of the base material, wherein the microporous layer has pores with a mean pore size of less than 100 nm.
A process for manufacturing an electrically conductive structure on a support, comprising preparing a base material and printing the base material with an electrically conductive ink by means of the inkjet printing process, wherein a microporous layer with a mean pore size of less than 100 nm is arranged on the base material.
A printed circuit, comprising a support material formed from a base material and a microporous layer arranged on the base material, wherein the microporous layer has pores with a mean pore size of less than 100 nm and the printed circuit is produced by printing the support material with an electrically conductive particle-containing printing ink by means of the inkjet printing process.
Dependencies are inferred from the claim text.