Housing for electronic device and method for making the same
AssigneesFIH (Hong Kong) Limited, Shenzhen Futaihong Precision Industry Co., Ltd.
InventorsZHU-SHA WENG, YONG-GANG ZHU
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Abstract
A housing for an electronic device includes a base and a pattern layer formed on the base. The pattern layer includes a blasting area and peripheral area, the blasting area has rough surface formed by sandblasting, the blasting area is a pattern section and has a width of at least 70 micrometer; the peripheral area has a slippery surface a peripheral section of the pattern section. The disclosure also described a method to make the housing.
Claims13
A housing of electronic device, comprising:
- a base;
- a pattern layer formed on the base;
- wherein the pattern layer includes a blasting area and a peripheral area, the blasting area has rough surface formed by sandblast, the blasting area is a pattern section and has an width of at least 70 micrometer;
- the peripheral area has slippery surface adjacent the pattern section.
A method for making a housing of electronic device, comprising:
- making a shielding film, the shielding film including a base layer, an intermediate layer and an emulsion layer, the emulsion layer defining a bore area and a shielding area adjacent to the bore area;
- attaching the shielding film on a base, the emulsion layer contacting with a surface of the base;
- peeling the base layer from the shielding film;
- blasting the base, blasting material passing trough the bore area of the emulsion layer to abrade the surface of the base and forming a blasting area, the blasting area corresponding to the bore area of the emulsion layer;
- eliminating the emulsion layer to expose a peripheral area on the surface of the base, the peripheral area corresponding to the shielding area, the blasting area and the peripheral area corporately forming a pattern layer.
The method for making a housing of electronic device as claimed in claim 10, wherein during development of the emulsion layer, soaking the film base in a solution, with a temperature of the solution no more than 49 degree centigrade, after half a minute, taking the film base out from the solution, spraying the emulsion layer, with a pressure on the emulsion layer in a range of 344-550 kpa, defining the bore area in the emulsion layer.
Dependencies are inferred from the claim text.