High thermal conductivity/low coefficient of thermal expansion composites
AssigneeMomentive Performance Materials Inc.
InventorsWei Fan, Xiang Liu, John Mariner
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Abstract
A high thermal conductivity/low coefficient of thermal expansion thermally conductive composite material for heat sinks and an electronic apparatus comprising a heat sink formed from such composites. The thermally conductive composite comprises a high thermal conductivity layer disposed between two substrates having a low coefficient of thermal expansion. The substrates have a low coefficient of thermal expansion and a relatively high modulus of elasticity, and the composite exhibits high thermal conductivity and low coefficient of thermal expansion even for composites with high loadings of the thermally conductive material.
Claims26
A thermally conductive composite comprising:
- a first metal substrate;
- a second metal substrate;
- and
- a layer of thermal pyrolytic graphite disposed between the first and second metal substrates, the first and second metal substrates bonded to the graphite layer and comprising a metal having a modulus of elasticity of about 200 GPa or greater, the composite having a in-plane coefficient of thermal expansion of about 13 ppm/° C. or less and a thermal conductivity of about 200 W/m-K or greater.
An electronic structure comprising:
- an electronic device;
- and
- a heat sink assembly in thermal contact with the electronic device, the heat sink assembly comprising a thermally conductive composite comprising a piece of thermal pyrolytic graphite disposed between first and second metal substrates, the first and second metal substrates bonded to the graphite and comprising a metal independently having a modulus of elasticity of about 200 GPa or greater, and the composite having a coefficient of thermal expansion of about 13 ppm/° C. or less and a thermal conductivity of about 200 W/m-K or greater.
A composite sheet comprising:
- a first metal substrate chosen from at least one of tungsten, molybdenum, tungsten-alloys, and molybdenum-alloys;
- a second metal substrate chosen from at least one of tungsten, molybdenum, tungsten-alloys, and molybdenum alloys;
- and
- a thermal pyrolytic graphite sheet disposed between the first and second metal substrates, the thermal pyrolytic graphite sheet comprising a plurality of layered planes, the composite sheet having a coefficient of thermal expansion of about 13 ppm/° C. or less and a thermal conductivity of about 200 W/m-K or greater.
Dependencies are inferred from the claim text.