Debonder to manufacture semiconductor and debonding method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsIl Young Han, Ho Geon Song, Sang Wook Park, Ji-Seok Hong
Life of this patent
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Abstract
A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.
Claims19
A debonder to manufacture a chip stack assembly, the debonder comprising:
- a stage to support a carrier wafer upon which the chip stack assembly is disposed;
- a temporary adhesive layer to adhere the chip stack assembly to the carrier wafer;
- a chuck to selectively attach to the chip stack assembly;
- a lifting unit to lift the chuck from the stage;
- a lateral driving unit to move the chuck laterally with respect to the stage;
- and
- a controller to control the lifting unit and the lateral driving unit to lift the chip stack assembly from the carrier wafer and move the chip stack assembly laterally with respect to the carrier wafer.
A method to debond a chip stack assembly adhered to a carrier wafer by a temporary adhesive, the method comprising:
- lifting the carrier wafer from the carrier wafer;
- and
- debonding the chip stack assembly from the carrier wafer by moving the chip stack assembly laterally with respect to the carrier wafer.
A debonder to debond a chip stack assembly, the debonder comprising:
- a stage to support a carrier wafer upon which the chip stack assembly is adhered by a temporary adhesive;
- a chuck to selectively attach to the chip stack assembly;
- a lifting unit to lift the chuck with respect to the stage;
- a lateral driving unit to laterally move the chuck with respect to the stage;
- and
- a rotation unit to rotate the chip stack assembly relative to the carrier wafer.
Dependencies are inferred from the claim text.