Substrate receiving device and substrate thermocompression-bonding device

A substrate backing device for placing and holding a first substrate and for receiving, from therebelow, a pressing force during thermocompressively bonding a second substrate to the first substrate, the substrate backing device comprising:

• a base portion provided with a horizontal flat surface in its upper surface;
• and
• a backing plate which is adapted to be contacted, at its lower surface, with the flat surface of the base portion and, further, is provided, in its upper surface parallel with its lower surface, with a backing support surface adapted to come into contact with a lower surface of the first substrate for supporting it;
• wherein the backing support surface includes a holding flat-surface portion adapted to hold the lower surface of the first substrate placed on the backing plate, an opening portion which is shaped and positioned to encompass a compression bonding area of the first substrate placed thereon which is to be compressively bonded to the second substrate, and a height reference portion which is provided adjacent to the opening portion and is adapted to restrict the first substrate in terms of its heightwise position, and
• wherein the backing support surface is provided with a receiving member which is placed within the opening portion and is adapted to, during the thermocompression bonding, come into contact with the lower surface of the first substrate and with a component having been preliminarily mounted on this lower surface in an area coincident with the compression bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.