Manufacturing method for monolithic ceramic electronic component

A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:

• preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
• performing a first cutting including cutting the mother block along a first cutting line to obtain a plurality of rod-shaped green block bodies, the rod-shaped green block bodies each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by cutting along the first cutting line;
• affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer;
• performing a second cutting including cutting each of the rod-shaped green block bodies on which the raw ceramic protective layer has been formed, along a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of raw component bodies that are each a component body in a raw state;
• and
• firing each of the raw component bodies;
• wherein
• the rod-shaped green block bodies obtained by the first cutting step are arrayed in a predetermined direction;
• the manufacturing method further comprises the step of, prior to the affixing step, tumbling the rod-shaped green block bodies in a state in which the rod-shaped green block bodies arrayed in the predetermined direction are spaced apart from each other, to make the cut side surface of each of the rod-shaped green block bodies uniformly an open surface;
• and
• the affixing step includes the step of affixing the side surface ceramic green sheet to the cut side surface of each of the rod-shaped green block bodies that has become the open surface.

A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:

• preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
• and
• cutting the mother block along a first cutting line and a second cutting line extending in mutually perpendicular or substantially perpendicular directions to obtain a plurality of green chips, the green chips each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by cutting along the first cutting line;
• wherein
• the green chips obtained by the cutting step are arrayed in row and column directions;
• and
• the manufacturing method further comprises the step of, after the cutting step, tumbling the green chips in a state in which the green chips arrayed in the row and column directions are spaced apart from each other, to make the cut side surface of each of the green chips uniformly an open surface.