Method and apparatus utilizing a single lift mechanism for processing and transfer of substrates

A method for processing one or more substrates, comprising:

• transferring one or more substrates disposed on a substrate carrier supported by a robot blade to a chamber;
• moving a plurality of lift pins into contact with the substrate carrier;
• supporting the substrate carrier above a plane of the robot blade;
• moving the robot blade out of the chamber;
• moving the substrate carrier into a supported position on an edge ring;
• moving the lift pins to a position where each of the plurality of lift pins are engaged with the edge ring;
• and
• lifting the edge ring and the substrate carrier to a processing position.

An apparatus for processing multiple substrates, comprising:

• a chamber body having an internal sidewall;
• a plurality of chamber support features coupled to an interior surface of the internal sidewall and extending into the processing volume;
• an edge ring disposed in the processing volume, the edge ring comprising:
• an annular body;
• a shoulder portion, the shoulder portion defining an inner diameter of the annular body;
• and
• a plurality of tabs disposed on the shoulder portion in a circular pattern having a diameter that is less than the inner diameter of the annular body;
• and
• a support assembly disposed in the processing volume, the support assembly having at least three lift pins that are selectively movable to a first position to engage the plurality of tabs and a second position to extend through the inner diameter of the annular body.