Printed wiring board and method for manufacturing the same

A method for manufacturing a printed wiring board, the method comprising:

• forming a first ground layer having a first opening;
• forming a signal wiring having a land disposed at a position eccentrically with respect to a center of the first opening and extending from the land in a direction of a nearest outline part of the first opening on the first ground layer via an insulator;
• forming a second ground layer having a second opening at a position similar to that of the first opening and having a shape similar to that of the first opening on the signal wiring via an insulator;
• forming a third ground layer having a third opening larger than the second opening and having the same center as the land on the second ground layer via an insulator;
• forming a first penetration hole penetrating the land;
• forming second penetration holes disposed along a circle concentric with a center axis of the first opening and penetrating the first and the second ground layers without contacting with the signal wiring and the third ground layer;
• and
• forming a first through hole and second through holes in the first and the second penetration holes, respectively.