Polymerizable compound and curable composition comprising same
AssigneeShowa Denko K.K.
InventorsKazuhiko Ooga, Ritsuko Azuma
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AssigneeShowa Denko K.K.
InventorsKazuhiko Ooga, Ritsuko Azuma
Estimating the term…
Provided are a polymerizable compound, a photocurable composition, and a photocurable moisture-proof insulating coating material for mounting circuit boards, which reduce environmental impact, excel in surface curability at low irradiation dose, and have high adhesion to substrate materials. The compound according to the present invention has a structural unit derived from a dimerdiol and has, as an end group, a group represented by formula (1): wherein R1 represents H or CH3 and R2 represents a hydrocarbon group having 2 to 12 carbon atoms, at an end thereof. Preferably, the compound has, as end groups, the group represented by formula (1) and a group represented by formula (2): wherein R3s each independently represent CH3 or CH2CH3, and R4 represents a hydrocarbon group having 3 to 9 carbon atoms, at the end thereof. The structure having the structural unit derived from a dimerdiol is preferably represented by formula (3):
A compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):
A method for producing a compound having a structural unit derived from a dimerdiol and having, as an end group, a group represented by formula (1):
A method for producing a compound having a structural unit derived from a dimerdiol and having, as end groups, a group represented by formula (1):
Dependencies are inferred from the claim text.