Off-angled heating of the underside of a substrate using a lamp assembly

A method of treating a substrate having apertures formed in a first surface thereof, the method comprising:

• positioning a substrate on a substrate support in a processing chamber;
• depositing a first material over the first surface and in the trenches in the processing chamber;
• and
• reflowing the deposited first material by irradiating a second surface of the substrate opposite the first surface in the processing chamber.

A chamber for processing a single substrate, comprising:

• a substrate support actuated to move between a processing location and a substrate transportation location inside the chamber, the substrate support comprising:
• a substrate receiving surface having a plurality of passages formed therein and a plurality of openings formed therethrough;
• and
• a lift pin assembly coupled to the substrate support, the lift pin assembly comprising a plurality of lift pins disposed through the openings and actuated to extend above the substrate receiving surface;
• an annular lamp disposed on a plurality of pins extending radially inward from a side wall of the chamber, the annular lamp defining a radiant source plane that is between the processing location and the substrate transportation location;
• and
• a concave annular reflector disposed around the annular lamp.