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US 2012/0231397 A1Published application
Wafer Fabrication Process
AssigneeRave, LLC
InventorsJeffrey E. Le Claire, Kenneth G. Roessler, David Brinkley
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Abstract
A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
Claims2
A wafer fabrication process, comprising:
- pre-print wafer processing;
- wafer print processing using at least one photomask having a pellicle;
- photomask clean processing, including directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition;
- wafer print processing using the photomask;
- and
- post-print wafer processing.
3 more elements
Dependencies are inferred from the claim text.