Chip through flooring material using pla resin
AssigneeLG Hausys, Ltd.
InventorsCheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Abstract
Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
Claims13
A chip through flooring material using a PLA-resin, comprising:
- a chip through layer;
- and
- a surface treatment layer formed on a surface of the chip through layer, wherein the chip through layer comprises a PLA resin.
Dependencies are inferred from the claim text.