Optical Module Design in an SFP Form Factor to Support Increased Rates of Data Transmission

An apparatus comprising:

• a connector device with stacked sockets configured to engage small form-factor pluggable (SFP) boards, each socket having a first socket surface configured to engage a first surface of SFP board and a second socket surface configured to engage a second surface of the SFP board, wherein each of the stacked sockets comprises:
• a first set of contacts disposed along the first socket surface that are configured to engage a first set of signal pads of the SFP board;
• a second set of contacts disposed along the second socket surface that are configured to engage a second set of signal pads of the SFP board;
• and
• a third set of contacts disposed along the second socket surface configured to engage a third set of signal pads of the SFP board;
• wherein
• the first socket surface and the second socket surface are aligned along a first plane that is parallel to the first surface and second surface of the SFP board.

A method comprising:

• arranging a first set of signal pads along an edge of a first surface of a small form-factor pluggable (SFP) board at an end portion thereof;
• arranging a second set of signal pads along an edge of a second surface of the SFP board at the end portion;
• arranging a third set of signal pads on the second surface of the SFP board at the end portion such that the third set of signal pads are offset from the edge of the second surface;
• and
• coupling the first, second and third sets of signal pads to a transceiver configured to transmit and receive signals via signal pads of the third set and to transmit and receive signals via signal pads of at least one of the first and second set.

A method comprising:

• transmitting and receiving signals via at least one of:
• a first set of signal pads disposed on along an edge of a first surface of a small form-factor pluggable (SFP) board at an end portion;
• and a second set of signal pads disposed along the an edge of a second surface of the SFP board at the end portion;
• transmitting and receiving signals via a third set of signal pads disposed on the second surface of the SFP board at the end portion and offset from the edge of the second surface;
• and
• operating a transceiver coupled to the SFP board at a data rate that is higher than a data rate achievable by transmitting and receiving signals via only the first or second set of signal pads.