Method for manufacturing camera module and camera module
AssigneeKabushiki Kaisha Toshiba
InventorJunichi ABE
Life of this patent
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Abstract
Certain embodiments provide methods for manufacturing camera module including arranging a camera module body in a first shield and forming a resin having a light shielding effect. The camera module body has: a sensor board which has a sensor unit; and an optical element which has a lens unit and a spacer. The process of arranging this camera module body in the first shield is a process of arranging the camera module body in the first shield such that a gap is formed between the camera module body and the first shield. The process of forming the resin having the light shielding effect is a process of forming the resin having the light shielding effect in the gap between the first shield and camera module body.
Claims19
A method for manufacturing a camera module comprising:
- arranging a camera module body which comprises a sensor board having a sensor unit and an optical element having a lens unit and a spacer, in a first shield such that a gap is formed between the camera module body and the first shield;
- and
- forming a resin comprising a light shielding effect in the gap between the first shield and the camera module body.
A camera module comprising:
- a sensor board having a sensor unit;
- an optical element which is set on the sensor board and has a lens unit and a spacer;
- a first shield which is arranged such that a gap is formed between the first shield and a camera module body which comprises the optical element and the sensor board;
- and
- a resin which is formed in a gap between the first shield and the camera module body and which comprises a light shielding effect.
Dependencies are inferred from the claim text.