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US 2012/0227258 A1Published application
Insulating layer for rigid printed circuit boards
AssigneeIntegral Technology, Inc.
InventorChristopher A. Hunrath
Life of this patent
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Abstract
One or more embodiments contained herein disclose rigid printed circuit boards (PCBs) and methods for manufacturing the same comprising strain resistant layers configured to, among others, minimize defects from occurring in cap layers of the PCBs.
Claims20
A method of manufacturing printed circuit boards, the method comprising:
- providing a component comprising a first surface of a strain resistant cap layer engaging a first surface of a conductive layer, wherein the strain resistant cap layer comprises polyimide;
- and
- attaching the component a stack of laminates by attaching a second surface of the strain resistant cap layer to a top surface of a first layer of the stack of laminates, wherein the stack of laminates comprises at least one rigid insulating layer extending throughout the entire length of the printed circuit board to define the printed circuit board comprising entirely rigid portions.
A component for manufacturing rigid printed circuit boards, the component comprising:
- a conductive layer comprising a first surface and a second surface;
- a discardable layer comprising a first surface, wherein the first surface of the discardable layer is attached to the first surface of the conductive layer;
- and
- a strain resistant layer comprising a first surface, wherein the first surface of the strain resistant layer is attached to the second surface of the conductive layer, and wherein the strain resistant layer comprises at least two characteristics selected from a group of:
- ductility of at least about 15%, Tg of at least about 220° C., and tensile strength of at least about 10,000 psi.
2 more elements
Dependencies are inferred from the claim text.