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US 2012/0225251 A1Published application
Etching and hole arrays
AssigneeNorthwestern University
InventorsChad A. Mirkin, Khalid Salaita
Life of this patent
Estimating the term…
Abstract
Lithographic and nanolithographic methods that involve patterning a first compound on a substrate surface, exposing non-patterned areas of the substrate surface to a second compound and removing the first compound while leaving the second compound intact. The resulting hole patterns can be used as templates for either chemical etching of the patterned area of the substrate or metal deposition on the patterned area of the substrate.
Claims40
1-24. (canceled)
A method comprising providing a tip and a substrate;
- applying a first compound from the tip to a surface of the substrate to produce a patterned area;
- depositing a second compound on a non-patterned area of the surface by exposing the substrate to the second compound;
- selectively removing the first compound from the patterned area of the surface so that the second compound on the non-patterned area of the surface remains deposited on the non-patterned area;
- and depositing a material on the patterned area of the surface.
1 more element
(canceled)
A method comprising providing a nanoscopic tip and a substrate;
- applying a first compound from the tip to a surface of the substrate to produce a patterned area;
- depositing a second compound on a non-patterned area of the surface by exposing the substrate to the second compound;
- selectively removing the first compound from the patterned area of the surface so that the second compound on the non-patterned area of the surface remains deposited on the non-patterned area;
- and depositing a material on the patterned area of the surface.
1 more element
(canceled)
Dependencies are inferred from the claim text.