Sliver structure and method of handling sliver structures
AssigneeMicron Technology, Inc.
InventorsGurtej S. Sandhu, Naga Chandrasekaran
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Abstract
Methods for orienting a plurality of sliver structures include applying at least one directional force to a group of sliver structures each having an orientation material applied to an edge to cause the plurality of sliver structures to orient in a common direction. The method may also include capturing the oriented sliver structures in a capture device to maintain the orientation of the sliver structures in the common direction. The oriented sliver structures may be used to form sub-assemblies such as solar array sub-assemblies that are used to generate solar power. Methods of applying an orientation material to sliver structures and resulting sliver structures are also disclosed.
Claims26
A method of handling sliver structures, the method comprising:
- applying at least one directional force to a sliver structure comprising a semiconductor material, the sliver structure bearing an orientation material on an edge thereof, to cause the sliver structure to orient in a desired direction.
A method of handling sliver structures, the method comprising:
- forming a plurality of sliver structures in a bulk semiconductor substrate, each sliver structure having a first edge and a second edge opposite the first edge;
- applying an orientation material to the first or second edge of each sliver structure to create an effective asymmetry about a transverse axis between the first edge and the second edge;
- detaching the plurality of sliver structures from the bulk semiconductor substrate;
- and
- applying a directional force to the plurality of sliver structures to orient the plurality of sliver structures in a common direction responsive to the effective asymmetry created by the orientation material.
A method of forming sliver structures, the method comprising:
- forming a plurality of sliver structures in a substrate material;
- and
- applying an orientation material to an edge of each sliver structure.
The method of claim 19, further comprising detaching the plurality of sliver structures from the substrate material.
A sliver structure comprising:
- a body comprising a semiconductor substrate material having a first edge and a second edge opposite the first edge;
- and
- an orientation material located along at least a portion of an edge of the body.
Dependencies are inferred from the claim text.