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AssigneeNational Institute of Avanced Industrial Science and Technology
InventorsManabu Yoshida, Toshihide Kamata
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Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate (1) and a conductive pattern (5) provided on the substrate (1), wherein the conductive pattern (5), except on a surface and in a vicinity thereof on a side opposite to the substrate side, entirely has a structure comprising a binder (2) and fine aluminum grains (3) dispersed therein, and on the surface and in the vicinity a surface metal aluminum layer (4) is formed in which the fine aluminum grains (3) are spread with a roller to form a conductive junction connecting the fine aluminum grains to each other.
A conductive substrate characterized by comprising a plastic substrate and a conductive pattern provided on the substrate, wherein the conductive pattern has a structure whereby fine aluminum grains are dispersed entirely in a binder made of an insulating resin except on the surface and in a vicinity thereof on a side opposite to the substrate side, and on the surface and in the vicinity a surface metal aluminum layer is formed in which the fine aluminum grains are spread with a roller to render their crystal lattice distorted, and an insulating aluminum oxide film produced on a surface of the fine aluminum grain is broken to form a conductive junction connecting the fine aluminum grains to each other;
(canceled)
A method of manufacturing a conductive substrate, characterized in that a conductive paste having a given amount of fine aluminum grains dispersed in a binder, being a solvent made of an insulating resin, is used to form a film-forming pattern on a plastic substrate by a film-forming means, and the film-forming pattern is heated to remove the solvent in the film-forming pattern and dried, after which a surface of the film-forming pattern containing the fine aluminum grains is pressurized in both the horizontal direction and vertical direction, under heating, to produce a conductive pattern where an insulating aluminum oxide film produced on a surface of the fine aluminum grain is broken;
(canceled)
Dependencies are inferred from the claim text.