Polyamideimide adhesives for printed circuit boards
AssigneeSun Chemical Corporation
InventorsRichard Charles Davis, Simon Richard Ford, Stephen Anthony Hall, Matthias Khaus, Karl-Heinz Ognibeni
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Abstract
The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.
Claims34
A liquid, thermal-curing, adhesive composition, comprising a polyamideimide having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group.
A thermal-curing, adhesive composition comprising a polyamideimide, wherein the composition is a liquid at 25 ° C. and wherein the composition has a viscosity of less than 35 Pa·s at 25° C. after storage for three months at 15° C.
Use of a liquid polyamideimide to form complete or partially imaged adhesives in the production of flexible or rigid-flexible printed circuit boards, displays, photovoltaic devices or membrane switches.
Dependencies are inferred from the claim text.