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AssigneeSony Chemical & Information Device Corporation
InventorKazunori HAMAZAKI
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To mount electronic components with different types of electrodes en masse on a substrate, the present invention comprises a heating section that heats an electrode of a first electronic component and an electrode of a second electronic component among the plurality of electronic components; a heat releasing section that releases heat from the electrode of the first electronic component and the electrode of the second electronic component; a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section; and a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section. The first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time.
A mounting device that bonds a plurality of electronic components to a substrate using thermal compression, comprising:
A method for manufacturing an electronic module in which a plurality of electronic components are mounted on a substrate, comprising:
Dependencies are inferred from the claim text.