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US 2012/0222794 A1Published application
Transfer substrate and method for fabricating organic electroluminescent element
AssigneeSony Corporation
InventorsShigeyuki Matsunami, Yasunori Kijima
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Abstract
A transfer substrate includes a light transmissive support substrate; a light-heat conversion layer formed on the light transmissive support substrate; and a transfer layer formed on the light heat conversion layer. The transfer layer is a layer transferred as a luminescent layer of an organic electroluminescent element and is made of a metal complex, a fluorescent luminescent dopant and an aromatic hydrocarbon whose matrix skeleton has four to seven rings.
Claims7
A transfer substrate comprising:
- a light transmissive support substrate;
- a light-heat conversion layer on said light transmissive support substrate;
- and
- a transfer layer on said light heat conversion layer,
- wherein,
- said transfer layer is a layer transferred as a luminescent layer of an organic electroluminescent element and is made of a metal complex, a fluorescent luminescent dopant and an aromatic hydrocarbon whose matrix skeleton has four to seven rings.
3 more elements
A method for fabricating an organic electroluminescent element comprising the steps of:
- forming a pattern of a lower electrode on a device substrate;
- forming an organic layer including at least a luminescent layer on said lower electrode;
- and
- forming an upper electrode laminated on said lower electrode through said organic layer,
- wherein,
- said luminescent layer is formed by (a) providing a transfer substrate obtained by forming, on a light transmissive support substrate, a light heat conversion layer and a transfer layer constituted of three types of organic materials including a host material and a fluorescent luminescent dopant in this order, (b) placing said transfer substrate in face-to-face relation with said device substrate in such way that said transfer layer is opposed to a side of said device substrate, and (c) sublimating said transfer layer by beam irradiation from a side of said support substrate to transfer said transfer layer to above of said device substrate.
3 more elements
Dependencies are inferred from the claim text.