Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit
AssigneeCorning Incorporated
InventorsLisa A. Lamberson, Robert M. Morena
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AssigneeCorning Incorporated
InventorsLisa A. Lamberson, Robert M. Morena
Estimating the term…
An antimony-free glass suitable for use in a frit for producing a hermetically sealed glass package is described. The hermetically sealed glass package, such as an OLED display device, is manufactured by providing a first glass substrate plate and a second glass substrate plate and depositing the antimony-free frit onto the first substrate plate. OLEDs may be deposited on the second glass substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first glass substrate plate to the second glass substrate plate and also protects the OLEDs. The antimony-free glass has excellent aqueous durability, good flow, low glass transition temperature and low coefficient of thermal expansion.
A method of forming a glass package comprising:
A method of forming an organic light emitting diode device comprising:
Dependencies are inferred from the claim text.