Method of manufacturing a printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJee Soo MOK, Je Gwang Yoo, Chang Sup Ryu
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Abstract
A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The printed circuit board is made slim, and reliability and the degree of design freedom are increased.
Claims9
A method of manufacturing a printed circuit board, comprising:
- forming at least one circuit layer on a semi-cured insulating layer, the circuit layer having a connection pad;
- forming insulating materials on the insulating layer, the insulating materials having an opening through which the connection pad is exposed;
- and
- pressing and embedding the circuit layer and the insulating materials into the insulating layer.
Dependencies are inferred from the claim text.