Back to results
US 2012/0218713 A1Published application
Heat radiation material, electronic device and method of manufacturing electronic device
AssigneeFujitsu Limited
InventorsYoshitaka Yamaguchi, Taisuke Iwai, Shinichi Hirose, Daiyu Kondo, Ikuo Soga, Yohei Yagishita, Yukie Sakita
Life of this patent
Estimating the term…
Abstract
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.
Claims13
An electronic device comprising:
- a heat generator;
- a heat radiator;
- and
- a heat radiation material disposed between the heat generator and the heat radiator and comprising a plurality of linear structures of carbon atoms and a filling layer formed of a thermoplastic resin and disposed between the plurality of linear structures.
1 more element
A method of manufacturing an electronic device comprising:
- disposing between a heat generator and a heat radiator a heat radiation material including a plurality of linear structures of carbon atoms, and a filling layer formed of a thermoplastic resin and disposed between the plurality of linear structures;
- heating the heat radiation material to melt the thermoplastic resin;
- and
- cooling the heat radiation material to set the thermoplastic resin.
1 more element
A heat radiation component comprising:
- a heat radiator;
- and
- a heat radiation material formed on the heat radiator, and including a plurality of linear structures of carbon atoms, and a filling layer formed of a thermoplastic resin and disposed between the plurality of linear structures.
Dependencies are inferred from the claim text.