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US 2012/0198695 A1Published application
Manufacturing method of heat pipe type heat-dissipating device
AssigneeIcepipe Corporation
InventorSang-Cheol Lee
Life of this patent
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Abstract
There is disclosed a manufacturing method of a heat pipe type heat-dissipating device. The method includes the steps of: winding a pipe on a loop forming mold in a spiral shape to form a pipe loop; and pressing at least a section of an outer circumference of the pipe loop so that the pipe loop is plastically deformed in a shape corresponding to the shape of the loop forming mold.
Claims14
A manufacturing method of a heat pipe type heat-dissipating device, comprising the steps of:
- winding a pipe on a loop forming mold in a spiral shape to form a pipe loop;
- and
- pressing at least a section of an outer circumference of the pipe loop so that the pipe loop is plastically deformed in a shape corresponding to the shape of the loop forming mold.
Dependencies are inferred from the claim text.