Method for Manufacturing a Hybrid Composite Wafer Carrier for Wet Clean Equipment

A method of making a carrier for use in preparing a substrate, comprising:

• forming body comprising a core material having a first side and a second side, the core material having a layer of thermoplastic formed over both the first side and second side of the core material;
• forming an opening in the body, the opening being sized to receive the substrate and defined with a plurality of pins, the plurality of pins extending into the opening in a parallel orientation relative to a surface of the first and second sides of the body;
• applying a thermal curing cycle to the body to minimize residual stresses and reduce non-flatness characteristics of the body;
• applying a pressure over a top surface and edges of the thermoplastic layers to ensure confinement of the body;
• and
• machining the body to define the carrier, the machining being configured to define dimensions of the opening and outer size parameters of the carrier.